The Vertex N G3 achieves its performance improvement through four technology upgrades: Ultra cell platform technology for higher power and bifaciality; multi-cut technology to reduce current losses; ...

Delivers industry’s fastest performance capability with 1-gamma DRAM and advanced packagingBOISE, Idaho, May 12, 2026 (GLOBE ...

Here’s a sampler of the new developments editors James Morra and Lee Goldberg got to see during their visit to APEC 2026.

Micron Technology, Inc. (Nasdaq: MU), today announced it has sampled 256GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers.

Beyond this consortium, NoMIS Power's 3.3 kV SiC MOSFETs and power modules are available as supply to other DC-GRIDS teams, as well as to broader medium- and high-voltage power electronics developers.

SiC role is expanding across the new energy vehicles, rail traction, industrial motors, renewable grid connection, and ...

In the HiPEQ project, a consortium of industry and research partners has de-veloped new laser-based approaches to enable miniaturized, robust beam sources for quantum technology. Among others, the ...

India’s chip ambitions are moving beyond fabs toward advanced packaging, glass substrates, and chiplets technologies that ...

The 256GB DDR5 RDIMMs are manufactured on Micron's 1-gamma process and are more than 40% faster than DDR5 modules currently ...

Micron is sampling a new 256GB DDR5 registered dual in-line memory module (RDIMM) to boost AI data centre performance.

This edition of PowerBites explores a cavalcade of power innovations from the recent APEC event, looks at how California is ...

In an era where “smart packaging” and interactive retail interfaces are becoming standard, the role of high-quality TFT modules is paramount. This article explores the technological milestones ...