A durable time‑to‑market advantage in hardware development comes from deliberately designing for scale from day one.

The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult for developers to find the best fit.

Power modules handle heat, moisture, and high voltage while making design easier and reducing failures. Learn more about ...

Aimed at applications that need to transition from a microcontroller (MCU) to a microprocessor (MPU) to handle increased processing requirements, Microchip Technology Inc. has expanded its MPU-based ...

Renesas Electronics Corp. has expanded its “Winning Combinations” portfolio with a new scalable artificial intelligence (AI) system-on-module (SoM) Smart Mobility ARChitecture (SMARC) board solution ...

Xilinx’s Zynq family has been an extremely successful system-on-chip (SoC) FPGA solution. However, as with many FPGA platforms, using this flexible solution can be especially tough when it comes to ...

Trina Solar Co., Ltd. (“Trina Solar” or the “company”), a leading global PV and smart energy total solution provider, has published a helpful asset for investors, utilities, IPP, project developers ...

What happens when edge computing runs entirely on performance cores? A modular platform hints at deterministic processing for ...