Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...

The US Department of Commerce unveiled modified rules to impose further export curbs on advanced chips and semiconductor manufacturing equipment to China, with chipmakers such as Nvidia, Intel, and ...

DUBLIN, Ireland--(BUSINESS WIRE)--Nov. 7, 2005--Research and Markets (http://www.researchandmarkets.com/reports/c27154) has announced the addition of IC Design Houses ...