Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

Astrus, a Canada-based startup focusing on analog IC design automation, is aspiring to revolutionize the global chip design industry by leveraging recent breakthroughs in artificial intelligence (AI).

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven ...

With the emergence of the design chain, design kits have become essential for linking semiconductor manufacturers and design teams developing IC-based products. To this end, EDA industry standards ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

It appears the Trump administration has imposed new export controls on chip design software as it seeks to further undermine China’s ability to make and use advanced AI chips. Siemens EDA, Cadence ...

The US Department of Commerce unveiled modified rules to impose further export curbs on advanced chips and semiconductor manufacturing equipment to China, with chipmakers such as Nvidia, Intel, and ...