Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...
Durability of components under dynamic load can be increased by understanding the origin of the stress and strain distribution. While numerical simulations based on finite element (FE) models can help ...
MALVERN, Pa.--(BUSINESS WIRE)--The Micro-Measurements ® brand of Vishay Precision Group, Inc. (NYSE: VPG) (www.micro-measurements.com), industry experts in the design, development, and manufacture of ...
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