The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
For the PDF version of this article, click here. As the dc-dc conversion industry proceeds toward the demand for improved power density and efficiency, thermally enhanced packages with SO-8 footprints ...
For example, if a MOSFET in an SO8 package (θ JD = 15°C/W) dissipates a P j of 1 W and must maintain a junction temperature below 125°C, then the measured drain temperature must not exceed 110°C ...
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