JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...
Chip and silicon intellectual property technology company Rambus Inc. today announced HBM4E Memory Controller IP, a new solution that delivers breakthrough performance with advanced reliability ...
XCENA Inc., a startup with a memory device designed to speed up artificial intelligence clusters, today announced that it has raised $135 million in funding. The Series B round was led by Korean funds ...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Astera Labs, the global leader in semiconductor-based connectivity solutions for AI infrastructure, today announced that its Leo Memory Connectivity Platform ...
This is the third and final of a series from Alphawave Semi on HBM4 and gives and examines custom HBM implementations. Click here for part 1, which gives an overview of the HBM standard, and here for ...
Explosive growth of generative artificial intelligence (AI) applications in recent quarters has spurred demand for AI servers and skyrocketing demand for AI processors. Most of these processors — ...
The pace of AI innovation continues to expose a painful reality. Compute keeps scaling, but memory bandwidth remains one of the hardest bottlenecks to remove. As AI models grow larger and more complex ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the industry’s leading HBM4E Memory Controller IP, ...
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