A ribbon-cutting ceremony of a new advanced semiconductor research and development center in Union City marks the first such ...

Molex, the major global electronics company, has agreed an acquisition that will give it direct access to silicon photonics technology designed to optimize co-packaged optics (CPO) and fiber ...

Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more ...

The production of iPhones in India is just going to get larger and larger, with a new report saying that Apple has entered into preliminary talks to start packaging chips in the country. Apple's work ...