Microchip’s JANPTX transient voltage suppressors (TVS) are among the first to achieve MIL-PRF-19500 qualification in a ...

V SiC power modules includes a 608-A half-bridge module with 2.4-mΩ on-resistance and best-in-class thermal resistance.

Among high-frequency laminates, Rogers Corporation materials are widely regarded as industry benchmarks. Three laminates in particular—RO4350B, RO4003C, and RO3003—are frequently selected for RF, ...

After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

Abstract: In this study, a miniature and high performance RF front-end module based on liquid crystal polymer (LCP) substrate is presented. The module consists of microstrip low pass filter (LPF) and ...

Memory maker Micron (MU) reported a blowout first quarter earnings report on Wednesday, beating expectations on the top and bottom lines and offering a better-than-anticipated outlook for the second ...

Abstract: This paper presents two innovative packaging techniques for Monolithic Microwave Integrated Circuits (MMICs) designed for multilayer waveguide-based antennas operating near 100 GHz. The ...

CEA-Leti and STMicroelectronics presented results at IEDM 2025 showcasing the key enablers for a new high-performance and versatile RF Si platform co-integrating best-in-class active and passive ...