Among high-frequency laminates, Rogers Corporation materials are widely regarded as industry benchmarks. Three laminates in particular—RO4350B, RO4003C, and RO3003—are frequently selected for RF, ...
Empower RF Systems has announced the release of its latest C-UAS RF amplifier module, Model 1211, engineered for robust ...
The Ebook delves into key radio frequency (RF) design topics ranging from signal chain fundamentals and antenna selection to ...
After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...
See it as part of Qualcomm’s technology showcase at NRF 2026, January 11–13, 2026, at the Javits Center, NYC, Booth ...
The ISP2454-LX family from Insight SIP is a Bluetooth Low Energy module platform built on Nordic Semiconductor’s nRF54L15 SoC ...
V SiC power modules includes a 608-A half-bridge module with 2.4-mΩ on-resistance and best-in-class thermal resistance.
RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.
Abstract: In this paper, we propose a system with a miniaturized antenna structure in the 915 MHz band that can place a circuit or module with a battery in the center. The circular folded dipole ...
Abstract: Silicon interposers are providing interesting alternatives to organic packages for the fabrication of complex system in package (SIP) modules in particular for RF application. Among the ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback