Abstract: Burrs, cracks, and scratches are often produced on silicon carbide (SiC) wafers during various processing stages, such as rolling and cutting. To address these challenges, edge grinding ...

Abstract: Spectral pixels are often a mixture of the pure spectra of the materials, called endmembers, due to the low spatial resolution of hyperspectral sensors, double scattering, and intimate ...

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Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled.

Mitsui Chemicals, Inc. is advancing the development of Diffrar™ polymer wafers for waveguides used in augmented reality (AR) glasses, with a view to expanding the augmented and virtual reality markets ...