Electronic Design

Press-Fit pin Enables Solder-Less Assembly

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...
Business Insider

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing

CHANDLER, Ariz., Dec. 06, 2023 (GLOBE NEWSWIRE) -- The E-Mobility, sustainability and data center markets require products that are conducive to high-volume ...
pv magazine International

Data Shock! Field Test at Northern Shaanxi Ground-Mounted Power Station: Jinko TOPCon Delivers Up to 10.79% Power Generation Gain—Where Lies BC’s Advantage?

Recently, to study the practical application performance of TOPCon modules and BC modules in desert areas, a comparative analysis was conducted on the actual power generation data of a PV power ...
Nasdaq

Alpha and Omega Semiconductor Unveils Its Mega IPM-7 Series Intelligent Power Modules Engineered to Improve Application Performance and Deliver Increased Power Density

New power modules have an optimized high-efficiency, compact, and durable design that is ideal for BLDC motor drives The Mega IPM7 series is AOS’ new generation of intelligent power modules engineered ...
Nasdaq

Navitas Semiconductor Launches New SiCPAK™ Power Modules with Advanced Epoxy-Resin Technology for High-Power Applications

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
EDN

1,200-V SiC power modules deliver high reliability

Navitas Semiconductor has expanded its portfolio of SiCPAK power modules with new 1,200-V devices that feature epoxy-resin potting and proprietary trench-assisted planar SiC MOSFET technologies. These ...