CHANDLER, Ariz., Dec. 06, 2023 (GLOBE NEWSWIRE) -- The E-Mobility, sustainability and data center markets require products that are conducive to high-volume ...
Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...
New power modules have an optimized high-efficiency, compact, and durable design that is ideal for BLDC motor drives The Mega IPM7 series is AOS’ new generation of intelligent power modules engineered ...
Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
Navitas Semiconductor has expanded its portfolio of SiCPAK power modules with new 1,200-V devices that feature epoxy-resin potting and proprietary trench-assisted planar SiC MOSFET technologies. These ...