Great news for AMD and Nvidia, less so for cash-strapped consumers Memory makers just can't churn out their DRAM fast enough.

The use of POE as an encapsulant in TOPCon module construction could limit the effects of degradation on the module’s ...

(Yicai) Jan. 13 -- Forehope Electronic said the Chinese integrated circuit packaging and testing services provider plans to ...

Solar manufacturers are facing rising cost pressure as silver paste now accounts for up to 30% of total cell production costs. OPIS analyst Hanwei Wu tells pv magazine that module producers currently ...

SK Hynix announces a $12.9 billion investment in a new chip packaging facility in Cheongju to address global AI memory chip ...

The global Co-Packaged Optics (CPO) market is set for transformative growth, driven by the burgeoning demands of AI, large language models, and generative AI. CPO technology addresses key issues such ...

Abstract: The reliability of power module packaging insulation is critical for the stable and safe operation of high-voltage power devices. Within the module packaging, the interface between the ...

SHANGHAI, SHANGHAI, CHINA, January 7, 2026 /EINPresswire.com/ -- Shanghai Mida Cable Group Limited, (collectively, ...

Abstract: To meet the requirements for high-density integration of T/R module, a miniaturized Ku-band silicon-based stacked multi-channel T/R module was designed and implemented. The module consists ...

NVIDIA remains a top semiconductor pick as AI-driven compute demand accelerates, while Amtech Systems emerges as a ...

Solarstic, an in-house venture spun out of Hyundai Motor Group, is showcasing its vehicle-integrated solar technology at CES ...

Tau has demonstrated that Ion-based converters can achieve efficiencies exceeding 99%, deliver meaningful system-level performance gains, and reduce overall converter size and cost. These advantages ...