The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

Forget 'rock in a box' GPUs, costly high-end RAM scams are being reported – here's how to avoid getting stung.

SAN JOSE, Calif.--(BUSINESS WIRE)--Today at Memcon 2024, Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory ...

Virtium, a trusted designer and manufacturer of industrial-grade memory, storage, and Edge AI solutions, today announced the launch of its new "Made in the USA" AI Accelerator Module, VMX-004, a ...

Micron Technology, Inc. has announced that it is the first and only memory company to ship both HBM3E and SOCAMM products for AI servers in data centers, reinforcing its leadership in low-power memory ...

Power management has received increasing focus in microelectronic systems as the need for greater power density, efficiency and precision have grown apace. One of the important ongoing trends in ...

TL;DR: SK hynix's new 256GB DDR5 RDIMM server memory modules, based on 32Gb DRAM, are officially verified for Intel's Xeon 6 platform, delivering up to 16% better inference performance and 18% ...

We heard about CAMM memory modules last year, but now JEDEC has published the new CAMM2 memory module standard that will find us receiving higher capacities, higher speeds, and massive space savings.

On Tuesday, Micron Technology, Inc. (NASDAQ:MU) disclosed that it is the first and only memory company to ship both HBM3E and SOCAMM (small outline compression attached memory module) products for AI ...

Asus has responded to recent reports claiming that the company is going to enter the memory module market. A recent report by ...