We are a research-led school with a reputation for excellent teaching and courses with real-world impact. We are based across four sites, comprising more than 2000 students and 190 specialist staff ...
Abstract: This study aims to fabricate low-taper through-silicon vias (TSVs) on 250 µm thick silicon substrates using an ultrashort pulse infrared (IR) laser combined with a burst mode technique.
Abstract: The computational and memory resources of wireless sensor nodes are typically very limited, as the employed low-energy microcontrollers provide only hardware support for 16 bit integer ...
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