A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...

An overview of the fundamentals of Finite Element Analysis (FEA) and its importance in aerospace component design. A look at how FEA software enables aerospace engineers to simulate the results of ...

Finite element modelling is widely used in industry to solve an endless number of practical problems, often involving non-linearity and dynamic loading. This module will teach how to robustly develop ...

In advanced engineering circles, the finite element method — or, more commonly, finite element analysis — is a real staple. With the advent of more powerful home computers, though, even your home ...

The book “Uncertain Analysis in Finite Elements Models” explains uncertainty analysis for finite elements and general nonlinear problems. It starts with the fundamentals of the topic and progresses to ...

Professor of Mechanics, Washington University, St. Louis, Mo. It's easy to construct finite-element models with errors. And it's just as easy to correct them, when you know how. The first step in a ...

In 2001, IBM patented a method of using a double bump material structure to make a reliable joint between a chip and its package for bump pitch below 150 µm. 1 This invention improved the existing ...