Abstract: The impact of carrier injection into mold epoxy resin on the device leakage current of power modules is investigated by our proposed model of the resin and its application to a simplified ...

Abstract: Next-generation power modules require rigorous evaluation of insulating substrates due to increasing voltage levels and the associated risk of partial discharge (PD). PD typically occurs in ...

OpenJDK project teams will focus work on features such as value types, code reflection, AOT compilation, and structured ...