Abstract: Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance, higher switching frequency, and lower power losses compared to traditional ...
Abstract: This article presents a novel millimeter-wave (mm-wave) single-chip gallium nitride (GaN) monolithic microwave integrated circuit (MMIC) transmit–receive (T/R) front-end for 5G-NR FR2 ...
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