The most durable tech is boring, old, and everywhere

Opinion: From COBOL and C to Linux and SQL, the unglamorous software that keeps the world running refuses to disappear ...
IEEE

High-Density Embedded 3-D Stackable Via RRAM in 16-nm FinFET CMOS Logic Process

Abstract: This study introduces a breakthrough achievement of 0.1-Gb/mm2 wing-shaped high-density embedded 3-D via resistive random access memory (Via RRAM) in TSMC’s 16-nm FinFET CMOS logic process.
IEEE

Knowledge-Associated Embedding for Memory-Aware Knowledge Tracing

Abstract: Knowledge tracing (KT) refers to predicting learners’ performance in the future according to their historical learning interactions, which has become an essential task for the computer-aided ...