Abstract: This article presents a novel millimeter-wave (mm-wave) single-chip gallium nitride (GaN) monolithic microwave integrated circuit (MMIC) transmit–receive (T/R) front-end for 5G-NR FR2 ...
Abstract: In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) ...
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