Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
Abstract: The paper focuses on the design of a Network-on-chip based programmable and partitionable distributed memory architecture which can be integrated with a Coarse Grain Reconfigurable ...
It has become increasingly clear in 2025 that retrieval augmented generation (RAG) isn't enough to meet the growing data requirements for agentic AI. RAG emerged in the last couple of years to become ...
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