Abstract: I welcome you to the fourth issue of the IEEE Communications Surveys and Tutorials in 2021. This issue includes 23 papers covering different aspects of communication networks. In particular, ...
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Play as android MIO in this mesmerizing metroidvania where you explore the Vessel, an enormous technological ark overgrown with machines gone rogue. Uncover its secrets, enhance MIO's abilities, and ...
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In this study, a 2.5D structure package called Molded Interposer on Substrate (MIoS) with an extremely large silicon interposer (>2800mm) on the body size assembled with 2-ASICs and 8-HBMs was ...