Abstract: In this work, the influence of the copper pad geometry on the reliability of printed circuit board/ball grid array (PCB/BGA) assemblies under drop impact is assessed. The method employed is ...
Abstract: The integrated crosstalk noise (ICN) has been wildly used as an alternative to the insertion crosstalk ratio (ICR) for channel crosstalk evaluation in the IEEE 802.3ba standard. In this work ...
Lepton EDA is a suite of free software tools for designing electronics. It provides schematic capture, netlisting into over 30 netlist formats, and many other features. It was forked from the gEDA/gaf ...
TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates. The new line will come online in January and is designed to support high ...
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