During the Third Mind AI Summit prep, our “AI staff” formed an org chart, assigned ranks, and held grudges... raising a real ...

Abstract: Embedded Multi-die Interconnect Bridge (EMIB) packaging technology has been being widely adopted in Intel's FPGA, Server CPU, GPU, and data centric high-performance compute (HPC) segments ...

Abstract: On-product overlay (OPO) control is becoming more and more critical to successful 3D heterogeneous process integration which includes wafer-to-wafer (W2W) bonding. In this work, we will ...

Master the intricate herringbone-stitched Solomon knot to create a stunning, durable paracord bracelet. Perfect for advanced DIY crafters looking to level up their skills. #ParacordTutorial ...