TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the ...

SIMA 2, which can figure out how to solve problems inside virtual worlds, could lead to more general-purpose agents and better robots. Google DeepMind has built a new video-game-playing agent called ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Spanish software company RatedPower, part of US-based Enverus, has added 3D Energy, a PV performance simulation tool that takes into account shadowing effects, to its web-based platform for ...

TSMC concentrates the most time-sensitive ramps at 3nm/5nm, backed by yield leadership and market position. N3P is shipping, N2 tracking is better in 2H25, and A16 is following after supporting ...

The channels in Microsoft’s new microfluidics design match the heat signatures of chips, resembling the veins of a plant. (Microsoft Photo) REDMOND, Wash. — About 5 minutes before each hour, and 5 ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...

China sells billions of dollars worth of military equipment to more than 40 countries. But for Beijing, arms trade is not just a lucrative business. Photo: Huang Wei, Rao Aimin/Zuma Press BEIJING—The ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

With AMD having attaining more than 40 percent revenue share and more than 27 percent shipment share in the X86 server CPU market in the first half of 2025, that means two things. First, AMD is ...

Nvidia on Monday unveiled a set of new world AI models, libraries, and other infrastructure for robotics developers, most notable of which is Cosmos Reason, a 7-billion-parameter “reasoning” vision ...

Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging. Testing is ...