Popular AI-powered integrated development environment solutions, such as Cursor, Windsurf, Google Antigravity, and Trae, ...

Abstract: Three-dimensional stacked integration based on through-silicon via (TSV) meets the high-speed development requirements of integrated circuits (ICs). However, TSV is a sensitive unit prone to ...

Abstract: Over the past decade, considerable steps have been made in designing wearable assistive devices that reduce the metabolic cost of walking. As the field continues to advance, a growing ...