Cold soldering defects in a PV module. The problem has now become the most commonly found defect in pre-shipping module inspections. Image: CEA The electric grid is complex. For many generation ...

Solder joint faults can be described with a single word – pernicious. Solder joints connect the BGA package, containing an FPGA (Field Programmable Gate Array) core, to the PCB (Printed Circuit Board) ...

AXI is an effective technology for finding manufacturing defects in electronics assembly operations. Manufacturers of advanced electronics products know that simultaneously producing a ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Manufacturers of advanced PCB assemblies know that simultaneously producing cost-competitive products and meeting the quality expectations of customers are vital to their success. Driven by advancing ...

Solder joint faults can be described with a single word – pernicious. Solder joints connect the BGA package, containing an FPGA (Field Programmable Gate Array) core, to the PCB (Printed Circuit ...