Among high-frequency laminates, Rogers Corporation materials are widely regarded as industry benchmarks. Three laminates in particular—RO4350B, RO4003C, and RO3003—are frequently selected for RF, ...
The 3,300- and 2,300-V SiC products from Navitas employ advanced planar device structures and packaging to augment efficiency ...
The Politecnico di Milano has created the first integrated and fully tunable device based on spin waves, opening up new ...
Compex has been a Qualcomm Authorized Design Centre (ADC) since 2014, helping customers design specialized, ...
The ISP2454-LX family from Insight SIP is a Bluetooth Low Energy module platform built on Nordic Semiconductor’s nRF54L15 SoC ...
As part of the BEYOND5 project, CEA-Leti was responsible for developing a RF power module (FEM) combining three essential RF functions: a power amplifier (PA), which amplifies transmitted signals; a ...
These assemblies join a growing selection of pre-configured cables designed to support wireless modules that connect externally to antennas and require a more rugged solution to ensure that the system ...
Infineon Technologies and automotive technology firm HL Klemove have signed a memorandum of understanding to expand their ...
See it as part of Qualcomm’s technology showcase at NRF 2026, January 11–13, 2026, at the Javits Center, NYC, Booth ...
Mouser Electronics, Inc. has released a new eBook that delves into key radio frequency (RF) design topics ranging from signal ...
The Ebook delves into key radio frequency (RF) design topics ranging from signal chain fundamentals and antenna selection to ...
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