Abstract: Conventional soldering processes in microsystem packaging often induce critical thermo-mechanical stresses, caused by mismatches in the coefficients of thermal expansion (CTEs) of materials ...
is editor-in-chief of The Verge, host of the Decoder podcast, and co-host of The Vergecast. Today, I’m talking with Prashanth Chandrasekar, who is the CEO of Stack Overflow. I last had Prashanth on ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback