Abstract: A novel two-step iterative optimization method could be used in microwave and mm-wave bands for optimal topology of 2-D sparse multiple-input multiple-output (MIMO) arrays, and an improved ...
Abstract: Through-silicon via (TSV) has attracted much attention due to its numerous advantages, including high-density interconnection, low power consumption, and wide bandwidth. When signals are ...
Make 3D assets generation in ComfyUI good and convenient as it generates image/video! This is an extensive node suite that enables ComfyUI to process 3D inputs (Mesh & UV Texture, etc.) using cutting ...
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