IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...
Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...
We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...
In a major push to boost domestic manufacturing, the government has approved 22 proposals under the third tranche of the ...
22 proposals worth $4.6 billion get government nod: How they will boost the electronics supply chain
Four chip companies are slated to begin commercial production this year --- with almost all the top automobile and telecom ...
The Government of India has approved 22 proposals under the third tranche of the Electronics Component Manufacturing Scheme ...
Mobile phone enclosures emerged as the biggest focus area as the government on Friday cleared 22 projects under the ...
India's Electronics Component Manufacturing Scheme (ECMS) approved 46 applications with an investment intention of ₹54,567 ...
The government has approved 22 investment proposals under the Electronics Component Production-Linked Incentive (PLI) scheme, ...
The 22 projects approved in the third tranche are expected to generate production worth ₹2,58,152 crore and create 33,791 ...
The scheme also provides particular support to MSMEs and emerging-sector manufacturers. Uno Minda on Monday said it has received approval under the Ministry of Electronics and Information Technology’s ...
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