Abstract: With the recent growth of the High Performance Computing and Artificial Intelligence markets, demand for advanced package which can integrate multi-chip is increasing. The I-Cube E is a new ...
Abstract: In this study, we present a ultra-thinned metasurface-cased antenna-in-package (MCAiP) for a millimeter-wave (mm-wave) 5G smartphone that operates in the n257 and n258 bands of FR2 ...
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