Workload consolidation has massive benefits, but implementation concerns have held back OEMs. Pre-integrated hardware and ...
Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...
After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...
HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...
A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...
The SGET announced a paradigm shift in embedded design with the official release of the Open Harmonised FPGA Module (oHFM) ...
Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc. The flagship ...
ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.
When Joan Lyon was diagnosed with Alzheimer's in 2023 she set out to share her experience while she still could.
Explore how repairable electronics, modular tech, and growing right to repair laws are reshaping consumer devices, reducing e ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback