Abstract: This letter presents a 300-GHz-band power amplifier (PA) module implementing a PA integrated circuit (IC) fabricated in 250-nm indium phosphide (InP) double-heterojunction bipolar transistor ...
Abstract: A novel on-dual in-line memory module (on-DIMM) low-pass filter (LPF) using via stubs is proposed to enhance signal integrity. Proposed on-DIMM LPF implemented with existing via stubs not ...
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