Cadence today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, ...

Learn Google Stitch 2.0 with Gemini 3.0 Pro, turning sketches into React, Tailwind, and HTML, so you ship prototypes and UI ...

Synopsys, Inc. is showcasing AI-driven and software-defined engineering solutions this week at CES that tackle one of the industry's biggest challenges: accelerating automotive engineering innovation ...

In high-intensity laser–matter interactions, including laser-induced particle acceleration, physicists generally want to work ...

At the inaugural Columbia SPS Faculty Summit on AI Teaching and Learning, faculty and industry experts explored AI’s emerging ...

At the CES conference, Jensen Huang, the company’s chief executive, said the more efficient and powerful chip would begin ...

Strong holiday viewership of advanced VSLive! Orlando sessions points to growing demand for immersive, hands-on training as ...