Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
For more than 50 years, scientists have sought alternatives to silicon for building molecular electronics. The vision was ...
The MarketWatch News Department was not involved in the creation of this content. DALLAS, Dec. 20, 2025 (GLOBE NEWSWIRE) -- In PDF https://bit.ly/437YX7H) The Crosetto Foundation for the Reduction of ...
SEOUL, South Korea, Dec. 22, 2025 /PRNewswire/ -- LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) ...
Cuts carbon dioxide emissions from its production by 50%—equivalent to planting 1.3 million trees annually. Boosts durability by up to three times for secure information recognition even with ...
LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) substrate’ that enhances performance while reducing carbon emissions by half ...
According to IDC's latest forecast, released on December 5, 2025, China is expected to overtake Taiwan, accounting for the world's second-largest integrated circuit (IC) design revenue starting in ...
Sharma, Fu, and Ansari et al. developed a tool for converting plain-text instructions into photonic circuit designs with the ...
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