Penguin Solutions, Inc. announced that its SMART Modular CXL NV-CMM E3.S 2T non-volatile memory module has successfully ...
Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 ...
The AI IXP platform will accelerate low-latency AI deployments to the network edge across the U.S.
Innodisk has launched its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc. The flagship EXMP-Q911 COM-HPC Mini module delivers up to 100 TOPS of AI ...
HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...
Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...
The SGET announced a paradigm shift in embedded design with the official release of the Open Harmonised FPGA Module (oHFM) ...
Abstract: Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance, higher switching frequency, and lower power losses compared to traditional ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.
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