Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.

The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

The AI chip giant has taken the wraps off its latest compute platform designed for test-time scaling and reasoning models, alongside a slew of open source models for robotics and autonomous driving ...

Gaming myths persist across forums, YouTube tutorials, and social media posts, often misleading players into chasing tweaks that deliver little to no improvement. FPS myths about RAM speed, VSync ...

From CPUs that overheated to those with poor performance—plus some that nearly killed the companies that made them.

Real-time hypervisors — the central technology for workload consolidation — enable the safe execution of multiple workloads ...

Nvidia CEO Jensen Huang officially launched the company’s new Rubin computing architecture, which he described as the state ...

AMD dominates CES 2026 with the reveal of Ryzen AI 400, the powerhouse Ryzen AI Max+ for creators, and the Ryzen 7 9850X3D, ...

Memory cards and SSDs are devices we rely on and expect to function flawlessly. At CES, Lexar will be launching new memory ...

"Nia Therapeutics publishes first in vivo validation of SNS" was originally created and published by Medical Device Network, ...

Nvidia CEO Jensen Huang gave an outlook on the upcoming AI server DGX Vera Rubin with in-house ARM processor cores and new ...

NVIDIA says its Rubin platform is now in full production, delivering up to 50 petaflops and powering the next wave of agentic ...