Abstract: The artificial neural network (ANN)-based compact modeling methodology is evaluated in the context of advanced field-effect transistor (FET) modeling for Design-Technology-Cooptimization ...
Abstract: This article focuses on the 3-D modeling methodology development of the wafer-to-wafer hybrid bonding (W2W-HB) annealing process. With its successful application in a 2-stack wafer-to-wafer ...
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