Abstract: Polarimetry is typically restricted to far-field characterization of a target using beam-like waves, which results in a 2 x 2 scattering matrix representation under two orthogonal in-plane ...
Abstract: The integration of a high aspect ratio Through Silicon Via (TSV) process with the EUV 7nm logic process was developed for the first time. The TSV and MOL to BEOL interface process was ...
1 School of Civil Engineering, Vellore Institute of Technology, Vellore, India 2 Centre for Disaster Mitigation and Management, Vellore Institute of Technology, Vellore, India The study aims to ...
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