Abstract: An advanced micromachining process has been developed to further push the performance limits of mass-produced inertial MEMS. The main achievement of the new platform technology is the usage ...
Abstract: An innovative 3D stackable wing-shaped Via RRAM is firstly proposed, featuring logic embedded ultra-high memory density (>0.1Gb/mm 2) and full compatibility with TSMC’s 16nm FinFET CMOS ...
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