Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...

A technical paper titled “Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration” was published by researchers at Rochester Institute ...

The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...

The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...

System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's daily life, and ...

Schematic of an oxide film/substrate system and the oxidation process. In the first stage, the flux affects the diffusion and adsorption of oxygen from gas to the gas/oxide interface. This image may ...

Scientists have recreated the reaction by which carbon isotopes made their way into different organic compounds, challenging the notion that organic compounds, such as amino acids, were formed by ...

TOKYO — Five Japanese companies have formed an R&D association to develop materials and technologies for high-density substrates that will be used in system-in-package devices, which store multiple ...

Highly functional and free-form displays are critical components to complete the technological prowess of wearable electronics, robotics, and human-machine interfaces. A team created stretchable OLEDs ...