Cold soldering defects in a PV module. The problem has now become the most commonly found defect in pre-shipping module inspections. Image: CEA The electric grid is complex. For many generation ...

Over the last several years, China’s PV industry has developed rapidly, its newly installed capacity ranking first in the world for 8 consecutive years. The time is right for the integration of smart ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

In the semiconductor industry, the outsourced semiconductor assembly and test (OSAT) sector plays a pivotal role in the global technology landscape. As the backbone of electronic device manufacturing, ...

AXI is an effective technology for finding manufacturing defects in electronics assembly operations. Manufacturers of advanced electronics products know that simultaneously producing a ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...

Manufacturers of advanced PCB assemblies know that simultaneously producing cost-competitive products and meeting the quality expectations of customers are vital to their success. Driven by advancing ...