In 1999, Stig Oresjo, then of Agilent Technologies, conducted a major study of solder-joint defects on printed-circuit boards (PCBs). The study, which at the time provided the most definitive data on ...

CEA’s 2026 manufacturing quality report finds that yield rates vary widely based on the age of solar module assembly ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

We might be amidst a chip shortage, but if you enjoy reverse-engineering, there’s never a shortage of intriguing old chips to dig into – and the 2513N 5×7 character ROM is one such chip. Amidst a long ...

Solder is the conductive metal glue that one uses to stick components together. If you get the component and the PCB hot enough, and melt a little solder in the joint, it will stay put and conduct ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...