A large modern computer can contain nearly half a million switching elements and 10 million high-speed memory elements. They ...
Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.
The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on ...
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AMD’s Ryzen CPU announcements this year fall firmly into the latter camp—these are all gently tweaked variants of chips that ...