EDN

Chip-and-package co-design relieves pressure on complex designs

The vise is closing down on design departments.Manufacturers want more capabilitiesin their products than ever before. It’simperative for manufacturers to remaincompetitive. Marketing, meanwhile,wants ...
Yahoo Finance

Cadence SiP Technologies and Allegro Package Designer Optimized for Hand-Held Consumer Electronics Market

TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...
EDN

3D chip/package/PCB co-design optimizes systems: Product how-to

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
Electronic Design

Advanced Package Design Fosters Smaller, More Efficient Semiconductors

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
Reading Eagle

1980s My Little Pony package designer speaks to Hamburg art class

Guest speaker Ruth Bush came to speak to the art class on Feb. 23. She is an artist, illustrator, and designer beginning out in Kutztown University. In the 1980s she was called by Hasbro to design ...