The Kontron ETXexpress®-690 COM Express™ Computer-on-Module is based on the latest AMD M690E and SB600 embedded chipset with the integrated Radeon™ X1200 graphics core and has been tested for DirectX® ...
LONDON--(BUSINESS WIRE)--The global computer on module market is expected to register a CAGR of approximately 7% during the period 2018-2022, according to the latest market research report by ...
Eching, Germany, July 8, 2008 – Kontron’s ETX 3.0 conforming ETX-CN8 Computer-on-Modules with the VIA C7 (1.5 GHz) or VIA Eden processors (500 MHz) are now available with the Windows Vista-ready VIA ...
VIA have announced their latest embedded device mainboard, and if you thought Pico-ITX had been spending too much time among the pie-aisles then the VIA Mobile-ITX form factor should please you.
The microETXexpress-SP Computer-on-Module employs an Intel Atom processor and offers full COM Express Pinout Type 2 compliance including SDVO graphics. Extending the COM Express specification to ...
(Logo: http://www.newscom.com/cgi-bin/prnh/20090226/PH75840LOGO) Read a case study on the EView development process at http://www.eurotech-inc.com/resources.asp. GE ...
When development teams at system and device manufacturers discuss waysin which development times and costs can be reduced, they usually endup turning to the use of Computer-On-Modules (COMs) for an ...
DUBLIN--(BUSINESS WIRE)--The "Global Computer on Module Market 2018-2022" report has been added to ResearchAndMarkets.com's offering. The global computer on module market is forecast to grow at a CAGR ...
Remember VIA's Mobile-ITX form factor, the 6 x 6 cm board format announced back in December 2009? Back then the computer-on-system module was more about proof of concept than production product; ...
Kontron has launched its first ultra low-power, low-profile ARM-based Computer-On-Module specifically designed to extend the proven and scalable Computer-On-Modules-based usage model to new modules ...
VIA Revolutionizes Compact Embedded Design with the World's First Mobile-ITX Module Introducing the VIA EPIA-T700, the first 6cm x 6cm computer-on-module based on the Mobile-ITX form factor Taipei, ...
What TI's AMP62P Sitara SoC brings to Toradex's Verdin AM62P computer-on-module. A look at the family of Verdin COM family. Toradex's carrier boards for industrial apps. The Verdin COM family supports ...
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